PRODUCTION > SURFACE MOUNT TECHNOLOGY

SMT line is completely automated and allows to control the production flow of semifinished products, without operator handling. SMT Line operators are highly qualified and check the performances of process control and productivity. All controls of every SMT process single phase are effected through a table microscope.
Solder paste printing, process quality hardcore, is made through a machine with automatic optical alignment. In order to guarantee a high quality standard of this process step, it is possible to program postprinting inspection cycles of the boards and of plate opening  in addition to dry and solvent cleaning cycles. Moreover machine entry is equipped with an automatic module for printed circuits cleaning, allowing to remove possible working or packing waste, dangerous during screen printing process.

Available pick and place machines allow to handle any range of components which could be found on the market: chip in case 0201, QFP with pitch 0.4, BGA and microBGA, CSP and “odd-form”.  STM line can host up to 240 feeder from 8mm offering in this way different advantages; it is possible to assemble boards with many components, using just one setup, introducing redundancies dedicated to multipicking, for better quality and productivity performances.

Setup operations are effected entirely offline, using a trolley system that supports feeders along the line. Trolleys, in addition to reducing equipment times, are a real warehouse on assembling line. Finally, different feeder types and MTC module allow DINEMA to use electronic components both in rolls and trays or possibly even in bars.

Re-melting oven is “hot forced air” and works already in inert atmosphere, through azote injection. It is made of counter-laid heating elements that let diffusion of heating with maximum efficiency and uniformity on all the board surface. Cooling is done through an active heat exchanger system helping in removing the board heating in the best way. In this way it is possible to obtain temperature profiles really accurate apart from the heat load involved. Every temperature profile is studied and validated ad hoc for each board, using a specific thermocouple detector regularly registered and calibrated in a SIT centre.

Automated optical inspection is done by a CCD videocameras system, that is able to view and to rebuild a 3D shape of every solder joint. Machine is equipped with a self-learning software improving performances to every subsequent batch. Moreover the entire station works  autonomously, recognizing boards and software through a barcode reader.

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